🛡️ Cooling Design: Premium aluminum heatsink – parallel fins for efficient heat dissipation and stability.
🔄 Overclocking Support: Intel XMP 3.0 & AMD EXPO – one-click performance boost with unlocked PMIC.
🧩 Capacity & Form Factor: 64 GB kit – 2×32 GB DDR5 UDIMM, 288-pin for desktop compatibility.
🧪 Reliability: Built with high-quality ICs – rigorously tested for durability and backed by lifetime warranty.
📏 Compact Design: Slim profile – 136.6×47×8.4 mm for easy fit in most gaming rigs.
Backed by a Limited Lifetime Warranty, this memory kit delivers next-gen power and peace of mind.
Product Specifications:
| Specification | Details |
| Brand / Series | Biwin / Black Opal HX100 |
| Capacity | 64 GB (2×32 GB) |
| Memory Type | DDR5 UDIMM |
| Speed | 6000 MHz |
| CAS Latency | CL30 |
| Voltage | 1.35 V |
| Timings | 30-38-38-76 |
| Pins | 288-pin |
| Cooling | Aluminum heatsink |
| Overclocking Profiles | Intel XMP 3.0 & AMD EXPO |
| Dimensions | 136.6 × 47 × 8.4 mm |
| Certifications | CE, FCC, RoHS |
| Country of Origin | China |
| Weight | 0.100 Kg |
| Warranty | Limited Lifetime |