💾 Premium Storage: Built with 3D TLC NAND and advanced caching (HMB & SLC) for faster response and extended lifespan.
🌡️ Thermal Control: Integrated graphene heat pad and smart temperature algorithm prevent throttling during heavy workloads.
⚡ DRAM-Less Design: Optimized architecture with Host Memory Buffer ensures high efficiency and lower power consumption.
🔗 Wide Compatibility: Fits M.2 2280 slots, backward compatible with PCIe 4.0 & 3.0 platforms for flexible upgrades.
🛡️ Reliable Endurance: Rated up to 2400 TBW, backed by 5-year limited warranty for long-term peace of mind.
Product Specifications:
| Specification | Details |
| Brand | Biwin |
| Series | Black Opal X570 |
| Model Number | BX570NN04TB-RGX |
| Capacity | 4TB |
| Interface | PCIe Gen5 ×4 |
| Protocol | NVMe 2.0 |
| Form Factor | M.2 2280 |
| Read Speed | Up to 14,500 MB/s |
| Write Speed | Up to 11,000 MB/s |
| NAND Type | 3D TLC |
| Cache | HMB & SLC |
| Design | Single-sided, DRAM-less |
| TBW (Endurance) | Up to 2400 TBW |
| Compatibility | PCIe 5.0, backward compatible with PCIe 4.0 & 3.0 |
| Warranty | 5 Years |
| Country of Origin | China |
| Weight | 7g |